Nexperia’s leadless package solutions enable the user to benefit from the same electrical performance in a smaller footprint. The resultant board real estate reduction, combined with the removal of bent leads and co-planarity issues in production, will reduce the overall cost of production. Nexperia leadless packages are Pb-free, RoHS and Dark Green compliant and are characterized over an extended temperature range of -40ºC to +125ºC and qualified to the AEC - Q100, grade one standard. This makes them suitable for high stress environments such as automotive and military applications. Board level reliability is also superior to WCSP and leaded packages, offering better adhesion to the PCB and being more impervious to chipping around the edges. These packages yield few failures during assembly and throughout the life of the end product. The contact pads are coated with Nickel Paladium Gold to prevent oxidation, and the moisture sensitivity level is one (MSL1). This eliminates the need for dry-packing and allows an unlimited storage time out of the bag.