I-PEX MINIDOCK STANDARD and SLIM rugged contact systems are rated up to 5,000 mating cycles and feature multiple points of contact for high reliability in board-to-board, vertical, and horizontal mating directions. Utilizing a zinc-alloy shell and copper-alloy spring contact on a 0.635 mm pin spacing, MINIDOCK products are reliable in harsh, rugged applications. Additionally, metal guide pins provide reliable mating for the connectors. The MINIDOCK SLIM offers a slimmer width and depth for applications where space is at a premium, as well as sequential contacts providing first mate, last break (FMLB) functionality. MINIDOCK interconnect solutions are ideal for applications requiring rapid docking and undocking of devices, consolidation of multiple interfaces such as power or digital I/O into a single interface, or those with the need for consistent, reliable connectivity under physical stress such as vibration or shock.
Features
- Robust die-cast structure
- Low insertion force contacts: 0.9 N max./pos.
- Durable up to 5,000 mating cycles
- Mating types: right-angle or vertical
- Pin counts available: 80, 100, 160, and 200
Innstillinger
Rask levering
Gratis frakt
Incoterms
Betalingstyper
Markedsplass-produkt
I-PEX MINIDOCK STANDARD and SLIM rugged contact systems are rated up to 5,000 mating cycles and feature multiple points of contact for high reliability in board-to-board, vertical, and horizontal mating directions. Utilizing a zinc-alloy shell and copper-alloy spring contact on a 0.635 mm pin spacing, MINIDOCK products are reliable in harsh, rugged applications. Additionally, metal guide pins provide reliable mating for the connectors. The MINIDOCK SLIM offers a slimmer width and depth for applications where space is at a premium, as well as sequential contacts providing first mate, last break (FMLB) functionality. MINIDOCK interconnect solutions are ideal for applications requiring rapid docking and undocking of devices, consolidation of multiple interfaces such as power or digital I/O into a single interface, or those with the need for consistent, reliable connectivity under physical stress such as vibration or shock.
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