Agilex™ 3 FPGAs and SoCs

The Altera Agilex 3 product family enables innovators to reach the next level of performance for their cost-optimized designs. Agilex 3 devices bring the 2nd generation HyperFlex™ FPGA architecture to these smaller devices, providing a 1.9X performance improvement over their previous cost-optimized family, Cyclone V, as well as higher-speed transceivers and adding memory support for LPDDR4. Small form factor is important to these applications. Agilex 3 devices utilize Intel’s innovative variable pitch BGA packaging technology, enabling up to 22% more balls in the same footprint as traditional 0.8 mm packages while maintaining the same 0.8 mm PCB design rules. With on-chip dual Cortex®-A55 Arm® cores and hardened peripherals, these devices offer a high degree of functionality in a small package.

Features

• Upgraded performance: Brings high performance to the power and cost-optimized space with the Altera HyperFlex Gen 2 core fabric technology as well as power-efficient transceiver I/Os
• Embedded dual processors: Dual Arm Cortex-A55 with advanced caching and a comprehensive set of hardened peripherals, provides users with the highest-efficiency embedded mid-range processor-based subsystem to augment FPGA functionality and/or pair with external host-class CPUs
• Built for AI and ML: The devices provide new levels of AI and DSP capabilities, with an FPGA logic fabric infused with AI tensor blocks
• Advanced connectivity: Access the latest Altera connectivity technologies; general purpose I/O, specialty I/O (LVDS, MIPI D-PHY), differential transceiver I/O, low-power hard IP blocks (PCIe 3.0, 10GbE Ethernet), and external memory interface (LPDDR4 hardened controller)
• Enhanced security: State-of-the-art security module with encryption, authentication, and tamper protection