Fair-Rite Products Corp.

Multi-Layer Chip Beads

Fair-Rite's chip beads with small package sizes accommodate automated placement and allow for a dense packaging of circuit boards

Image of Fair-Rite's Multi-Layer Chip BeadsFair-Rite’s cost-effective multi-layer chip beads suppress conducted EMI signals. These chip beads are high power for the automotive and mil-aero industries. However, they can also be used in an array of devices such as point-of-load DC/DC converters, thermostats, cellular phones, computers, laptops, pagers, and others. The small package sizes accommodate automated placements and allow for a dense packaging of circuit boards. Chip beads are 100% tested for impedance and DC resistance. They are available in standard, high, and GHz signal speeds. The multi-layer chip beads are organized by increasing package size and current carrying capacity.

Features
  • Cost-effective
  • High power
  • Small package sizes
  • Tested for impedance and DC resistance
  • Available in standard, high, and GHz signal speeds
Applications
  • Automotive
  • Mil-aero industries
  • Point-of-load DC/DC converters
  • Thermostats
  • Cellular phones
  • Computers
  • Laptops
  • Pagers
Published: 2021-08-30

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