Heat Sink BGA, FPGA Aluminum 1.5W @ 50°C Board Level
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Heat Sink BGA, FPGA Aluminum 1.5W @ 50°C Board Level
374324B60023G
374324B60023G

374324B60023G

DigiKey Part Number
HS522-ND
Manufacturer
Manufacturer Product Number
374324B60023G
Description
BGA HEAT SINK
Manufacturer Standard Lead Time
14 Weeks
Customer Reference
Detailed Description
Heat Sink BGA, FPGA Aluminum 1.5W @ 50°C Board Level
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Mfr
Series
Packaging
Bulk
Part Status
Active
Type
Board Level
Package Cooled
Attachment Method
Solder Anchor
Shape
Square, Pin Fins
Length
1.063" (27.00mm)
Width
1.063" (27.00mm)
Diameter
-
Fin Height
0.394" (10.00mm)
Power Dissipation @ Temperature Rise
1.5W @ 50°C
Thermal Resistance @ Forced Air Flow
6.00°C/W @ 500 LFM
Thermal Resistance @ Natural
30.60°C/W
Material
Material Finish
Black Anodized
Base Product Number
Product Questions and Answers

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In-Stock: 1 993
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Non-Cancelable/Non-Returnable
All prices are in NOK
Bulk
QuantityUnit PriceExt Price
1kr 34,71000kr 34,71
10kr 30,69500kr 306,95
25kr 29,23720kr 730,93
50kr 28,18000kr 1 409,00
216kr 26,07315kr 5 631,80
432kr 25,12917kr 10 855,80
648kr 24,59261kr 15 936,01
1 080kr 23,93233kr 25 846,92
Manufacturers Standard Package
Unit Price without VAT:kr 34,71000
Unit Price with VAT:kr 43,38750