Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level
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Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level
374324B00035G
374324B00035G

374324B00035G

DigiKey Part Number
HS318-ND
Manufacturer
Manufacturer Product Number
374324B00035G
Description
HEATSINK BGA W/ADHESIVE TAPE
Manufacturer Standard Lead Time
14 Weeks
Customer Reference
Detailed Description
Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Mfr
Series
Packaging
Box
Part Status
Active
Type
Board Level
Package Cooled
Attachment Method
Thermal Tape, Adhesive (Included)
Shape
Square, Pin Fins
Length
1.063" (27.00mm)
Width
1.063" (27.00mm)
Diameter
-
Fin Height
0.394" (10.00mm)
Power Dissipation @ Temperature Rise
3.0W @ 90°C
Thermal Resistance @ Forced Air Flow
9.30°C/W @ 200 LFM
Thermal Resistance @ Natural
30.60°C/W
Material
Material Finish
Black Anodized
Shelf Life
-
Base Product Number
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In-Stock: 2 513
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Non-Cancelable/Non-Returnable
All prices are in NOK
Box
QuantityUnit PriceExt Price
1kr 24,79000kr 24,79
10kr 21,91900kr 219,19
25kr 20,87720kr 521,93
50kr 20,12520kr 1 006,26
100kr 19,39820kr 1 939,82
250kr 18,47596kr 4 618,99
756kr 17,41992kr 13 169,46
1 512kr 16,78843kr 25 384,11
5 292kr 15,70289kr 83 099,69
Manufacturers Standard Package
Unit Price without VAT:kr 24,79000
Unit Price with VAT:kr 30,98750