Heat Sink BGA Copper Top Mount
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

MBA33002-21P/CU/3.4Y

DigiKey Part Number
4573-MBA33002-21P/CU/3.4Y-ND
Manufacturer
Malico Inc.
Manufacturer Product Number
MBA33002-21P/CU/3.4Y
Description
CU HEAT SINK 33X33X21MM WITH PIN
Manufacturer Standard Lead Time
5 Weeks
Customer Reference
Detailed Description
Heat Sink BGA Copper Top Mount
Product Attributes
Type
Description
Select All
Category
Mfr
Malico Inc.
Series
MBA
Packaging
Tray
Part Status
Active
Type
Top Mount
Package Cooled
BGA
Attachment Method
Clip
Shape
Square, Pin Fins
Length
1.299" (33.00mm)
Width
1.299" (33.00mm)
Diameter
-
Fin Height
0.709" (18.00mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
-
Thermal Resistance @ Natural
-
Material
Copper
Material Finish
-
Product Questions and Answers

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In-Stock: 38
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Quantity
All prices are in NOK
Tray
QuantityUnit PriceExt Price
1kr 54,55000kr 54,55
10kr 48,23900kr 482,39
25kr 45,95280kr 1 148,82
50kr 44,29220kr 2 214,61
100kr 42,69130kr 4 269,13
250kr 40,66056kr 10 165,14
500kr 39,18706kr 19 593,53
1 000kr 37,76558kr 37 765,58
Manufacturers Standard Package
Note: Due to DigiKey value-add services the packaging type may change when product is purchased at quantities beneath the standard package.
Unit Price without VAT:kr 54,55000
Unit Price with VAT:kr 68,18750
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