Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
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70-3213-0810

DigiKey Part Number
70-3213-0810-ND
Manufacturer
Manufacturer Product Number
70-3213-0810
Description
SOLDER PASTE NXG1 NO CLEAN 500GM
Manufacturer Standard Lead Time
2 Weeks
Customer Reference
Detailed Description
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
Datasheet
 Datasheet
Product Attributes
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Category
Mesh Type
3
Manufacturer
Kester Solder
Process
Lead Free
Series
Form
Jar, 17.64 oz (500g)
Packaging
Bulk
Shelf Life
8 Months
Part Status
Active
Shelf Life Start
Date of Manufacture
Type
Solder Paste
Storage/Refrigeration Temperature
32°F ~ 50°F (0°C ~ 10°C)
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Digi-Key Storage
Refrigerated
Melting Point
423 ~ 424°F (217 ~ 218°C)
Shipping Info
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Flux Type
No-Clean
Base Product Number
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
In-Stock: 11
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All prices are in NOK
Bulk
QuantityUnit PriceExt Price
1kr 2 144,70000kr 2 144,70
5kr 1 847,20400kr 9 236,02
10kr 1 731,69400kr 17 316,94
30kr 1 562,52233kr 46 875,67
50kr 1 489,25720kr 74 462,86
Manufacturers Standard Package
Unit Price without VAT:kr 2 144,70000
Unit Price with VAT:kr 2 680,87500