Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
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TS991SNL500T3

DigiKey Part Number
315-TS991SNL500T3-ND
Manufacturer
Chip Quik Inc.
Manufacturer Product Number
TS991SNL500T3
Description
SOLDER PASTE THERMALLY STABLE NC
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Manufacturer
Chip Quik Inc.
Series
CHIPQUIK®
Packaging
Bulk
Part Status
Active
Type
Solder Paste
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
-
Melting Point
423°F (217°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
3
Process
Lead Free
Form
Jar, 17.64 oz (500g)
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Base Product Number
TS991S
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In-Stock: 3
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Quantity
All prices are in NOK
Bulk
QuantityUnit PriceExt Price
1kr 1 031,94000kr 1 031,94
5kr 889,17200kr 4 445,86
10kr 833,80100kr 8 338,01
25kr 765,66920kr 19 141,73
50kr 717,68760kr 35 884,38
100kr 672,55660kr 67 255,66
Manufacturers Standard Package
Unit Price without VAT:kr 1 031,94000
Unit Price with VAT:kr 1 289,92500
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