Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 8.8 oz (250g)
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SMDLTLFP250T4

DigiKey Part Number
SMDLTLFP250T4-ND
Manufacturer
Manufacturer Product Number
SMDLTLFP250T4
Description
SOLDER PASTE LOW TEMP T4 250G
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 8.8 oz (250g)
Datasheet
 Datasheet
Product Attributes
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Category
Process
Lead Free
Manufacturer
Chip Quik Inc.
Form
Jar, 8.8 oz (250g)
Packaging
Bulk
Shelf Life
6 Months
Part Status
Active
Shelf Life Start
Date of Manufacture
Type
Solder Paste
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)
Composition
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Digi-Key Storage
Refrigerated
Melting Point
281°F (138°C)
Shipping Info
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Flux Type
No-Clean
Base Product Number
Mesh Type
4
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
In-Stock: 3
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All prices are in NOK
Bulk
QuantityUnit PriceExt Price
1kr 785,38000kr 785,38
Manufacturers Standard Package
Unit Price without VAT:kr 785,38000
Unit Price with VAT:kr 981,72500