PIC32MX1xx/2xx 28/36/44-PIN Datasheet by Microchip Technology
Q
MICROCHIP
SOIC»
0K3,
P‘c32MX210F0160
36
16+3
23
5/5/5
4/2
12
25
VTLA
VTLA‘
OK),
P‘CSZMXZZOFOBZC
36
32+3
23
5/5/5
4/2
12
23
VTLA
VTLA‘
SOME,
P‘CSQMXZSOFOMC
36
64+3
16
23
5/5/5
4/2
12
23
VTLA
VTLA‘
OK),
P‘c32MX250F1280
36
12a+3
32
23
5/5/5
4/2
12
23
VTLA
VTLA‘
OF‘
VTLA‘
Tms devwce features 3 KB of boat Hash memury.


MCLR
MCLR
MCLR
MCLR
MCLR
MCLR
MCLR
MCLR
MCLR
MCLR



EH
ii
:0 %%
4-D
AN0
27
33
19
l )
( 7
13D
13D
OC1 Ou‘pm Compare Oulpul 1
RCO ST PORTC is a bidirectional l/O port
U1CTS
U1RTS
UZCTS
UZRTS
Q
SDA1 ST Synchronous seria‘ data mpuI/oulpulfor
PMAO l/O TTL/ST ParaHe\ Masler PorlAddress bi: 0 inpu:
MCLR

MCLR
MCLR
MCLR
MCLR
MCLR
MCLR

PICSZ
Nan75v Taiwan!
Fm Ammtectms
VDD
Oil/Off
VSS
PIC32 VDD
(or Exlemal VDD CW
PICJZ
mespm 1 vss ‘
i
\/
ital Isolamr FIC3Z VDD
Digital Isola
Exlemal VDD
REMOTE IN
4,,
PICZZ VDD
Analog I Digital Isolalor Plcaz VDD
0pm Digiial
Conn
'SOLATDR Analogfiun —F‘" ANX
Externai VDD ExternaLVDD fir ri— _ p103;
Anaiogilm «— ~i——< flmfi="" analog="" “="" ’="" \‘="" remotejn="" switch(s)="" 1.="" ,="" vss="" vss="">
Floating BUS
Oxide BV=3 evn
P1632
5v Tole/am Pm VDD
A mhltecmls
0n/0If
P|C32
POWER
SUPPLY
"'VSS
1744—»






/

/











R LVDSTA




MCLR





usmsa o)





‘\\‘\4


If clock swimhing and monimring is disab‘ed (FCKSM<1.0> : 1x).
If clock swimhing and monitoring is enab‘ed (FCKSM<1.0> : Ox).
1.0>1.0>









When CRCTVP DCRCCON<15> :
When CRCTVP DCRCCON<15> :
When CRCTVP DCRCCON<15> :
When CRCTVP DCRCCON<15> :
15>15>15>15>
When CRCTYP DCRCCON<15> :
When CRCTYP DCRCCON<15> :
When CRCTYP DCRCCON<15> :
When CRCTYP DCRCCON<15> :
15>15>15>15>






Pallem Terminam mode
AH olher modes.






ETACHIE










USB E
If EPTXEN : 1 and EPRXEN :
m
R

XXX...
(I;
Q
UWCTS
U2CTS
Q









1““4
rrrr
‘‘‘‘‘‘
““““

In Asynchronous Timer mode.
In Synchronous ‘fimer mode
When TCS : 1.
When TCS : .
When TCS : .
iiiiii
777777
When TCS : 1.
When TCS


“W









1111
rrrr

g
When AUDEN
When AUDEN
Maser mode MSTEN : 1 .
Slave mode MSTEN : 3 .
E
SSX


Smndard Buffer Mode.
Enhanced Buffer Mode.
Smndard Buffer Mode.
Enhanced Buffer Mode.

LSB
Wnle
wme R
A2:
4AA
Shun Clock
9
4:4—
9
/\
\1
Wme

If STREN : l




UXCTS
UXRTS

UXRTS
UXRTS
UXRTS
UXCTS
RX. UXCTS UXRTS
UXRTS UXCTS
UXCTS UXRTS

If IrDA mode is dwsab‘ed i.e., IREN UXMODE<12> is ‘3'.
lferAmode is enab‘ed \.e.. IREN UxMODE<12>)\s‘1'.
12>12>


lwrile
Mg gégg
PMRD/PMWR f[‘

(PMALL PMALH
(PMCS1
For S‘ave Modes and Mas‘er mode 2 (MODE<1.0> : QO‘D,,,O)
PMWR
For Masmr mode 1 MODE<1.0> : I
PMENB
For S‘ave modes and Mas‘er mode 2 (MODE<1.0> : QO‘D,,,O)
PMRD
For Masmr mode 1 MODE<1.0> : I
PMWR
PMRD
1.0>1.0>1.0>1.0>
For Read ogerafions




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\
\
1 $l@9{m:
\
\
H|:|” ALRMDATE
‘ ‘ ‘ :
i {S
:w



ALRMEN '





L77777777777777774
VVVVV




AV Ex‘ernalV rpin
Ex‘ernalV +pin ExternalV rpin









When CVRR .
When CVRR .

r ;
EDGwsm V
EDGZSTAT
X—> 4» Currem
} I ‘ Comm
47

IDISSEN

















wwww









MCLR
MCLR
MCLR
\ +
w +
H H
MCLR
This parameter apphes m all pins,
V
our)
0m



}|
Load Condition 1 Load Condihon 2


‘ ‘H:
‘7
3 H (< ‘="" «7="">
z;
fl—> 1
3—»
1 §7
MCLR

5 M31 U
3 3 H r
1 EMS!) X snug-"4 >< l3”="" 1="" 1="" 43*="" d="" f="" ‘="" ‘="" as="" k="" #‘="" 3&1="" ”="">
SSX
Q
Q
Q
‘ / 1473104»: 1“
a k ‘ . 4 a: k





OO 00
OO
0000
00
00 000000
PPR?
: H ::
00000 00
OO
00
0000
00
OO
Wes
Wes
Param.
\+ +\



MCLR
MCLR
MCLR


IOH(A)
70.050
70.045
70.040
70.035
70.030
70.025
70.020
70.015
70.010
70.005
0.000
von 1V)
0.00
0.50
1.00
1.50
2.00
2.50
3.00
3.50
4.00
mum)
0.050
0.045
0.040
0.035
0.030
0.025
0.020
0.015
0.010
0.005
0.000
0.00
0.50
1,00
1.50
VOL 1v)
2.00
2,50
3.00
3.50
4,00
40
an
21:
MIPS
1n
2.5 Esau ma;
um
an
40
an
m
30
/
so
4n
211 an
Yemperalure (Eelslus)
20
MIPS
m
,m
1n
rzu
ran
41m
asu
anu
A
w w w w m u 5 o 5 o
z z 1 1 2 2 1 1
25 a. 3.... 3.
am
Temperature (Celsius)
mo mm
7950 (man
A 7970 mm
ET — mom
5 7960 i
= mm
s 7950 if
z > neon
.: 7940 u
g g 055m
.L 79:» u
“ 0500
7920 0450
7910 mm
7900 mm
ran an 720 4a a 10 20 an an su 60 70 so an um 40 .3u .20 ~10 w 20 an 40 so an 70 30 gm mu
umpemumcusms; nmuemumrcekiu-n
33
‘i‘
E 32
F
=
S
5
.L
E 31
A
30
AD 730 720 40 0 10 20 30 40 5D 60 70 80 90 100

220F
Q 0235
O G O
220F
0G 0 Q 35
X220
S
O“ o ’3
6‘ Q
Mlcnoculp Mlcnoculp
32D-I/F‘T
O O
28-Lead Plastic Shrink Small Outline (SS) — 5.30 mm Body [SSOP]
HHHHHHHHHHHHHH
28-Lead Plastic Shrink Small Outline (SS) - 5.30 mm Body [SSOP]
@HHHHHHHHHH
SILK SCREEN
l
l
l
lDDHDHUDHUDH:
JLHPM’
RECOMMENDED LAND PATTERN
Notes:
Unils MlLLlMETERS
Dlmension leils MlN l NOM l MAX
oomacl Pilch E 0.55 550
Comm Pad Spacing c 7 20
Cunlacl Pad Wldlh (X28) X1 0 45
Comm Pad Leng1h(XZE) Y1 1 75
Dlslance Between Pads G 0 20
1. Dimenslorllng and mleranclng per ASME Y14.5M
BSC: 83le Dlmension. Theoretically exact value shown without tolerances.
Mlcrochlp Technology Drawlng No 0047207“
28-Lead Plastic Small Outline (SO) - Wide, 7.50 mm Body [SOIC]
I NOTE 5
N
HHHHHHHHHHHHH”
///’/7 I
E 41% —--'- '''''
D I!‘
games UUU ULIWTJUUUUUU
2X 123
NOTE1 . ‘ H 2XNI2TIPS
! ‘ —— <— nxb="" w="" ‘9="" e="" notes="" tdfview="" a‘—="" —\="" q0100="" a="" nx="" --+—="" seat‘ngflane="" a2="" :1,="" sideview="" a="" see="" viewc="" view="" a-a="" mmrochlp="" techno‘ogy="" drawmg="" 004-0520="" shea:="" 1="" dz="">—>
28-Lead Plastic Small Outline (SO) - Wide, 7.50 mm Body [SOIC]
/\ k at Ax
e
w
7, L
lLll
4x 19 «
VIEW C
Unlts MlLLlMETERS
Dimension Lirnlts MIN l NOM | MAX
Number d1 Pins N 25
Pltch e 1 27 BSC
Overall Helgh! A . . 2.55
Molded Package Thickness A2 2 05 — —
Standofl § A1 0 10 - 0 30
Overall Width E 10.30 BSC
Molded Package Wldm E1 7 50 550
Overall Lengm D 17 90 ESC
Chamfer (oollonal) h 0 25 . 0.75
Fool Lenglh L 0 40 — 1.27
Foolpvlnl L1 1 4D REF
Lead Angle e 0’ . .
Fool Angle ¢ 0" — a"
Lead Thlckness c o 15 - 0 33
Lead wldth o 0 31 . 0.51
Mold Draft Angle Top zx 5° — 15°
Mold Draft Angle Bottom 6 5" , 15"
Nous:
1. Pin 1 visual lndex leature may vary, but must be located within the hatched area.
2 § slgnlhcanl Charactenstlc
3 Dlmenslun D does not lnclude mold llash, protruslons or gate burrs, whlch shall
not exceed 0.15 mm per end. Dlmension E1 does not lnclude ln|erlead flash
or pvalruslan. whlch shall no1 exceed 0 25 mm per side
4 Dlmensionlng and tolerancing per ASME VlA 5M
BSC: Basic Dlrnensioh. Theoretically exact value shown w1thout tolerances.
REF' Relerence Dimenslon. usually wlthout tolerance, lnr lnrorrnallon purposes only
5. Dalums A at B lo be determlned a1 Datum H
Mlcrochlp Technology Drawlng 00470520 Sheel 2 on
28-Lead Plastic SmaH Outline (SO) - Wide, 7.50 mm Body [SOIC]
*ll‘ 6*
~:;:HDHDHDDDDHDHHH
c SILK
G ”/— SCREEN
:HWWHHDDDDHDHDD:
a A |« »| L x
RECOMMENDED LAND PATTERN
Unus M‘LLIMETERS
Dwmenslun ants MIN | NOM \ MAX
Corned Puch E 1 27 336
Contact Pad Spacing c 9 4o
Ccmacl Fad wmm (x23) x 0.50
Contad Pad Lengm (X28) Y 2.00
Dwstance Between Pads Gx o 67
sttance Between Fads G 7 40
Notes.
1 Dimensmmng and Iolerancmg perASME Y14 SM
550. Basic Dwmension. TheorehcaHy exact value shown wwthout (o‘erances
Mmmcmp Technology Drawing No 004-2052A
Notes:
1 Dimensxoning and (o‘erancing per ASME v14 5M
J,
\
E
N
MUUUDE ‘ I
\
I \
c2 |:| |:| , 6
T2 :
— — — }U D D D D [ Y1
x1 El «
SILK SCREEN
RECOMMENDED LAND PATTERN
Umts MILUMETERS
Dwmensicn Lxmxls MIN | NOM \ MAX
Con'ad Pm E o 65 BSC
Ophonal Gamer Fad Wwdm W2 4 25
Ophonal Gamer Fad Lenglh 12 4 25
Contact Pad Spacmg C1 5 70
Comm Pad Spacmg oz 5 7n
Comacl Pad Wwdth (X28) X1 0 37
Contact Pad Length (x25) v1 1 00
Dlslance Between Pads G o 20
350 Basic Dimens‘on. Theorel‘ca‘ly exact value shown wuhoul to‘erances.
Microcmp Technology Drawmg No. COAVZWOSA
36-Terminal Very
with Exposed Pad [VTLA]
Thin Thermal Leadless Array Package (TL) — 5x5x0.9 mm Body
Note:
For Ihe mosl currenl package drawmgs, please see the Mlcrochlp Packagmg Specmcauon \ocated at
hllp://www.m\crocmpLom/packaging
// /// A
/ / /.
2 // ////
///////
NOTE1 /////////////////fl
_(/44{L/_/_4________
2X I
Q 010 C :
|
2X
E010 C TOPVIEW
A
5/ 010 c
SEAUNG PLANE f; 36X
J f Q one c
C
SIDEVIEW A1
D2
I
.
$01D®CAE EEDDUiDDDEg
(DATUM A) D i D FE
D \> 437
I] Hi
52 QYY“ i 7E!” t (NE-1)“;
D
D (DATUM B) ‘
E—-—-—
D
K _
SEE DETAILA
F7 (Narnxe 44
BOTTOM VIEW
chrochip Techno‘ogy Drawing 00471375 Shee| 1 0'2
36-Terminal Very Thin Thermal Leadless Array Package (TL) — 5x5x0.9 mm Body
with Exposed Pad [VTLA]
Note: Forthe most current package drawmgs, please see the Microchip Packaging Specmcanon \ocated at
hllp'llwww mwcrocmp com/packaging
V— (DATUM A OR B)
/H_\\ 7 36XL
”+\
I
.D d: | D D)
/
\\ \ ’ //
30x b
0 10® c A \ a‘
$ 0 05® c
DETAIL A
UmLs M‘LLW‘ETERS
Dwmensiun Limws MIN | NOM | MAX
Number of PMS N 35
Numbercf Pms per Slde ND 10
Number of Pms per Slde NE 8
Pitch e D 50 BSC
Overs” Height A 0 30 0 90 1 00
standofl A1 0 025 - 0 075
Overs” w‘dm E 5 00 BSC
Exposed Pad Wldlh E2 3 60 | 3.75 | 3.90
Overau Length D 5 00 BSC
Exposed Fad Length D2 3 an 3.75 3.90
Comacl Wwdlh b 0 20 0.25 0.30
Contact Lengm L 0 20 0.25 0.30
ContaclrloVExposed Pad K 0 20 . .
Notes:
1 Pm 1 vwsual mdex fealure may Vary, 0m mus‘ be located wflhln We halched area
2 Package ‘5 saw smgu‘aled.
3 Dwmensiomng and tolerancmg perASME Y14.5M.
BSC' Basic D‘mensmn Theoret‘ca‘ly exact value shown wwthout (o‘erances
REF Reference D‘menslun. usua‘ly wllhom mlevance, Var Inlormaflcn purpuses only
Mmmchlp Techno‘ogy Drawing c04-1a7c Sheet 2 5'2
44-Terminal Very Thin Leadless Array Package (TL) — 6x6x0.9 mm Body
With Exposed Pad [VTLA]
Note: For me mosl Currenl package drawmgs, please see me Mlcrochlp Packagmg SpeCIIIcaIIon Iocateu at
hllp:Nwww.mIcrochIp.com/packaging
2x
5 0.10 0
mp VIEW
f 44x
SEATING PLANE
i Q 008 C
SIDE VIEW A1 — t
“E
i
I
$010®CAB
PM)
2
'T (NE-1 xe
(DATUM AI—E
NOTE 1 7
/
6%
if
mmz z
In DID/El E D
0/
6/
//
(DATUM mi
D JIjIij
D JUDGE
manmninnhum
I
xv,“
— SEE DETAILA
.— (ND-Ina —»
BOTTOM VIEW
MICrDchlp TecnncIugy Drawlng 004-1570 sneeI I an
44-Terminal Very Thin Leadless Array Package (TL) — 6x6x0.9 mm Body
With Exposed Pad [VTLA]
Note: For me mos: currem package drawmgs. p‘ease see xhe Microchip Packaging Specrlrcalron \acamd ax
mmwwwwmrcmch\p.com/packagmg
f (DATUMAOR B)
a
/H_\\ r L
{U EUIEI D,‘_7
/
\
\ /
44x :2
o 1o® c A \ B‘
6} o.05® c
DETAIL A
Umls M‘LLIMETERS
Drmension Lirmls MIN | NOM | MAX
Number 0! Pms N 44
Number p1 Pms per Side ND 12
Number 0! Pms per Side NE 10
Pimh e u so 350
OveraH Heigm A u so u so 1 no
S|andalf A1 0.025 - 0.075
OveraH wmm E 5 no 330
Exposed Pad Widlh E2 4 40 | 4 55 | 4 7o
Overa‘l Length D 6 DO 880
Exposed Pad Lenglh D2 4 4O 4 55 4 7O
Cumacl Wldlh b D 20 U 25 U 30
Cuntacl Length L 0 20 U 25 0 30
CunIaCI-lo-Expcsad Pad K D 20 - -
Notes:
1 Pm 1 wsual mdex leamre may vary‘ bm must be located mm the hamhed area.
2 Package rs saw smgulaled.
3 D‘mens‘omng and tolerancmg per ASME Y1A SM
550 Basic Dimensrpn Theareucauy exact value shown wmhout rareranees
REF: Relerence Drmension‘ usuany wikhout tolerance, for inlormauon purposes pmy.
Mrcrpchip Technorogy Drawing 004—157(2 Sheet 2 an
ct
w
I \
i,t HEflDDDDDDDE-EtE E
L4 ‘7
|:| Cl 7
‘ |:| Cl 7
CI |:| f
C2 :| El r G
|:| |:|
T2 :I :l f
|:| |:|
|:| |:|
|:| |:| Y1
V—t CI
7, " DDDDDDDDDlTi
x14 L f
StLK SCREEN
RECOMMENDED LAND PATTERN
Units MtLLIMETERS
Dimenston Ltmils MtN \ NOM \ MAX
Contact Pitcn E 0.55 350
Cottonat Center Pad wtotn wz 6.80
ootionat Center Pad Lengtn T2 0.00
Contact Pad Spacing ct 23.00
Contact Pad soacing 02 0.00
Contact Pad Wtd|h (x44) x1 0.35
Contact Pad Length (x44) Y1 0.50
Dts'ance Between Pads 6 0 25
Notes
1. Dimenstomng and toleranctng per ASME Y14.5M
BSC' Bastc Dtmension Tneoretioatty exact vatue snown without (olemnces
Mtcrocntp Technotogy Drawing No 004-2103A
HHHHHHHHHHH ‘
fir
UUUUUUUUUUU
44-Lead Plastic Thin Quad Flatpack (PT) 1OX10X1 mm Body, 2.00 mm Footprint [TQFP]
C1
‘ DDDDDDDDDDE'ii
O l—
|:| |:|
|:| |:|
:: |:| |:|
|:| |:|
a 7 |:| |:|
|:| |:| CZ
|:| |:|
|:| |:|
|:| |:|
|:| SILK SCREEN |:|
|:| |:|
w UUHHHHUDDW-—
El L X1 *1 L E
RECOMMENDED LAND PATTERN
Units MILLIMETERS
Dimensmn Lnntts MW 1 NOM 1 MAX
Contact Pitch E 0.00 BSC
Contact Pad Spacing 01 11.40
Contact Pad Spacing c2 11.40
Contact Pad Wimn (x44) x1 0 55
Contact Pad Lengtn1x44) v1 1 50
D1stance Between Pads G 0.25
Notes
1 Dimensmmng and toleranmng perASME Y1A 5M
BSC Eas1c D1menslon ThearetlcaHy exact vame shown wmmut talerances
M1crocmp Techno1ogy Drawmg No 004720768





MCLR







x $44;
YSTEM
6‘
‘MICRDCHIP

